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Phosphorus Copper Filler is made by adding Phosphorus to Copper to lower the melting point and to give self-fluxing effect to Copper matrix. By adding Ag and Sn to Copper-Phosphorus dual alloy, it may be achieved to improve workability and diffusion, to lower the melting point and to improve fluidity. This Phosphorus Copper filler has high mechanical strength and good effect of anti- corrosion to be widely used for Copper and Copper alloy for ships and heat exchangers.

 

Product No.

Composition

Solidus

Liquidus

Brazing Temp

P

Ag

Cu

Others

BCuP2

7.15

 

bal

 

710

795

735-845

BCuP3

6.25

5.00

bal

 

645

815

720-815

BCuP5

5.05

15.00

bal

 

645

800

705-815

BCuP6

7.00

2.00

bal

 

645

790

730-815

BCuP680

6.75

 

bal

Sn7

640

680

660-750

BCuP825

6.00

 

bal

Sb2

690

825

 

 

 

 

 

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