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Phosphorus Copper
Filler is made
by adding Phosphorus to Copper to lower the melting point and to give
self-fluxing effect to Copper matrix. By adding Ag and Sn to Copper-Phosphorus
dual alloy, it may be achieved to improve workability and diffusion, to lower
the melting point and to improve fluidity. This Phosphorus Copper filler has
high mechanical strength and good effect of anti- corrosion to be widely used
for Copper and Copper alloy for ships and heat exchangers.
Product
No. |
Composition |
Solidus
|
Liquidus |
Brazing
Temp |
P |
Ag |
Cu |
Others |
BCuP2 |
7.15 |
|
bal |
|
710 |
795 |
735-845 |
BCuP3 |
6.25 |
5.00 |
bal |
|
645 |
815 |
720-815 |
BCuP5 |
5.05 |
15.00 |
bal |
|
645 |
800 |
705-815 |
BCuP6 |
7.00 |
2.00 |
bal |
|
645 |
790 |
730-815 |
BCuP680 |
6.75 |
|
bal |
Sn7 |
640 |
680 |
660-750 |
BCuP825 |
6.00 |
|
bal |
Sb2 |
690 |
825 |
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